Plano, TX, United States of America

Kevin J Anderson

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 61(Granted Patents)


Location History:

  • Bluffton, IN (US) (1999 - 2001)
  • Plano, TX (US) (1987 - 2024)

Company Filing History:


Years Active: 1987-2024

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15 patents (USPTO):Explore Patents

Title: Kevin J. Anderson: Innovator in Integrated Circuit Packaging

Introduction: Kevin J. Anderson, an accomplished inventor located in Plano, TX, has made significant contributions to the field of integrated circuit (IC) packaging. With a remarkable portfolio comprising 15 patents, Anderson has focused on developing advanced methods to enhance the performance and efficiency of IC packages.

Latest Patents: Among his latest innovations is a pioneering method for packaging an integrated circuit (IC) package that features an embedded heat spreader within a redistribution layer (RDL). This innovative design facilitates a high-density packaging solution for integrated circuits, including monolithic microwave integrated circuits (MMICs). Addressing the challenge of reduced heat removal from ICs, which can impair radio frequency (RF) circuit performance, his invention incorporates a heat spreader within the dielectric layer of the RDL attached to the IC die. This embedded heat spreader ensures efficient heat transfer and robust RF performance, enabling operation at millimeter wave (mmW) frequencies, all while maintaining a low-cost, low-profile surface mountable package.

Career Highlights: Kevin J. Anderson has garnered experience working with renowned companies, including Qorvo US, Inc. His work showcases his dedication to advancing technological solutions within the semiconductor industry.

Collaborations: Throughout his career, Anderson has collaborated with notable colleagues such as Tarak A. Railkar and Walid M. Meliane. These collaborations have fostered a dynamic exchange of ideas, significantly contributing to the successful development of his patents.

Conclusion: Kevin J. Anderson stands out as an influential figure in the field of IC packaging innovations. His dedication to enhancing RF circuit performance through efficient heat management solutions exemplifies the critical role of inventors in shaping technology today. As he continues to drive advancements in this area, his work will undoubtedly have lasting impacts on the semiconductor landscape.

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