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For the Inventor, By the Inventor

Plano, TX, United States of America

Kevin J Anderson

This inventor holds 15 USPTO granted patents and 2 published patent applications. Top assignees: Qorvo US, Inc., Texas Instruments Corporation, Other. Active years: 1987-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kevin J Anderson. Retrieved from https://idiyas.com/inventor/kevin-j-anderson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 62(Granted Patents)


Location History:

  • Bluffton, IN (US) (1999 - 2001)
  • Plano, TX (US) (1987 - 2024)

Company Filing History:

goldMedal12 out of 1,227 
 
Qorvo US, Inc.
 patents
silverMedal1 out of 29,869 
 
Texas Instruments Corporation
 patents
bronzeMedal2 out of 834,453 
Other
 patents

Years Active: 1987-2024

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15 patents (USPTO):Explore Patents
1. 11929300 - Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) (2024-03-12),
2. 11626340 - Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) (2023-04-11),
3. 10390434 - Laminate-based package with internal overmold (2019-08-20),
4. 10217686 - Air-cavity package with enhanced package integration level and thermal performance (2019-02-26),
5. 10217685 - Air-cavity package with dual signal-transition sides (2019-02-26),
6. 10177064 - Air cavity package (2019-01-08),
7. 9991181 - Air-cavity package with enhanced package integration level and thermal performance (2018-06-05),
8. 9974158 - Air-cavity package with two heat dissipation interfaces (2018-05-15),
9. 9935026 - Air-cavity package with dual signal-transition sides (2018-04-03),
10. 9799637 - Semiconductor package with lid having lid conductive structure (2017-10-24),
11. 9793237 - Hollow-cavity flip-chip package with reinforced interconnects and process for making the same (2017-10-17),
12. 9659898 - Apparatuses, systems, and methods for die attach coatings for semiconductor packages (2017-05-23),
13. 6202244 - Vehicle washing machine (2001-03-20),
14. 5979002 - Vehicle washing machine (1999-11-09),
15. 4658440 - Single balanced self-oscillating dual gate FET mixer (1987-04-14),

Title: Kevin J. Anderson: Innovator in Integrated Circuit Packaging

Introduction: Kevin J. Anderson, an accomplished inventor located in Plano, TX, has made significant contributions to the field of integrated circuit (IC) packaging. With a remarkable portfolio comprising 15 patents, Anderson has focused on developing advanced methods to enhance the performance and efficiency of IC packages.

Latest Patents: Among his latest innovations is a pioneering method for packaging an integrated circuit (IC) package that features an embedded heat spreader within a redistribution layer (RDL). This innovative design facilitates a high-density packaging solution for integrated circuits, including monolithic microwave integrated circuits (MMICs). Addressing the challenge of reduced heat removal from ICs, which can impair radio frequency (RF) circuit performance, his invention incorporates a heat spreader within the dielectric layer of the RDL attached to the IC die. This embedded heat spreader ensures efficient heat transfer and robust RF performance, enabling operation at millimeter wave (mmW) frequencies, all while maintaining a low-cost, low-profile surface mountable package.

Career Highlights: Kevin J. Anderson has garnered experience working with renowned companies, including Qorvo US, Inc. His work showcases his dedication to advancing technological solutions within the semiconductor industry.

Collaborations: Throughout his career, Anderson has collaborated with notable colleagues such as Tarak A. Railkar and Walid M. Meliane. These collaborations have fostered a dynamic exchange of ideas, significantly contributing to the successful development of his patents.

Conclusion: Kevin J. Anderson stands out as an influential figure in the field of IC packaging innovations. His dedication to enhancing RF circuit performance through efficient heat management solutions exemplifies the critical role of inventors in shaping technology today. As he continues to drive advancements in this area, his work will undoubtedly have lasting impacts on the semiconductor landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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