Qorvo Us, Inc.

Other

Texas Instruments Corporation

Kevin J Anderson

Tarak A Railkar

Walid M Meliane

Andrew Arthur Ketterson

Christo Pavel Bojkov

Deep C Dumka

Ning Chen

Anthony M Chiu

Anthony M Pavio

Jonathan J Fain

John Beall

Brian P Balut

An integrated circuit (IC) package with an embedded heat spreader in a redistribution layer (RDL) is provided. IC packaging facilitates a high density package for ICs, including monolithic microwave integrated circuits (MMICs). However, IC packaging may result in reduced heat removal from an IC, decreasing radio frequency (RF) circuit performance. In an exemplary aspect, an IC package is provided which incorporates an embedded heat spreader within a dielectric layer of an RDL coupled to an IC die. The embedded heat spreader provides efficient heat transfer, robust RF performance, and operation through millimeter wave (mmW) frequencies, all in a miniature low-cost, low-profile surface mountable (SM) package.

Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)

Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)

The present disclosure relates to a microelectronic package, which includes a base substrate, a perimeter wall, an electronic component, and a mold compound. The perimeter wall extends from a periphery of the base substrate to form a cavity that is over the base substrate and within the perimeter wall. The electronic component is mounted on the base substrate and exposed to the cavity. The electronic component is thermally coupled to a thermal management component, which extends through the base substrate and conducts heat generated from the electronic component. The electronic component is also electrically coupled to a wall signal via, which extends through the perimeter wall and transmits signals. The mold compound resides over the base substrate and within the cavity, so as to encapsulate the electronic component.

Laminate-based package with internal overmold

The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, and a top electronic component. The bottom substrate includes a bottom signal via extending through the bottom substrate and the top substrate includes a top signal via extending through the top substrate. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and electrically coupled to the bottom signal via. The top electronic component is mounted on the top substrate, exposed to the cavity, and electrically coupled to the top signal via.

Air-cavity package with dual signal-transition sides

The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, a top electronic component, and an external electronic component. The perimeter wall extends from a periphery of a lower side of the top substrate to a periphery of an upper side of the bottom substrate to form a cavity. The bottom electronic component is mounted on the upper side of the bottom substrate and exposed to the cavity. The top electronic component is mounted on the lower side of the top substrate and exposed to the cavity. And the external electronic component is mounted on an upper side of the top substrate, which is opposite the lower side of the top substrate and not exposed to the cavity.

Air-cavity package with enhanced package integration level and thermal performance

The present disclosure relates to an air-cavity package, which includes a substrate, a base, and a semiconductor die. The substrate includes a substrate body, thermal vias extending through the substrate body, and a metal trace on a bottom side of the substrate body and separate from the thermal vias. The base includes a base body, a perimeter wall extending about a perimeter of the base body, and a signal via structure. Herein, the bottom side of the substrate body resides on the perimeter wall to form a cavity, and the signal via structure extends through the perimeter wall and is electrically coupled to the metal trace. The semiconductor die is mounted on the bottom side of the substrate body, exposed to the cavity, and electrically coupled to the metal trace. The thermal vias conduct heat generated from the semiconductor die toward a top side of the substrate body.

Air cavity package

The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

Air-cavity package with two heat dissipation interfaces

The present disclosure relates to a semiconductor package with a lid that includes a lid conductive structure. The semiconductor package includes a substrate with a top surface, a lid over the top surface of the substrate, and at least one substrate-mounted component mounted on the top surface of the substrate. Herein, a cavity is defined within the lid and over the top surface of the substrate. The substrate includes a metal pad over the top surface of the substrate. The lid includes a lid conductive structure, a lid body, and a perimeter wall that extends from a perimeter of the lid body toward the top surface of the substrate. The lid conductive structure includes a body conductor that extends through a portion of the lid body and a wall conductor that is coupled to the body conductor, extends through the perimeter wall, and is electronically coupled to the metal pad.

Semiconductor package with lid having lid conductive structure

The present disclosure relates to a flip-chip package with a hollow-cavity and reinforced interconnects, and a process for making the same. The disclosed flip-chip package includes a substrate, a reinforcement layer over an upper surface of the substrate, a flip-chip die attached to the upper surface of the substrate by interconnects through the reinforcement layer, an air cavity formed between the substrate and the flip-chip die, and a protective layer encapsulating the flip-chip die and defining a perimeter of the air cavity. Herein, a first portion of each interconnect is encapsulated by the reinforcement layer and a second portion of each interconnect is exposed to the air cavity. The reinforcement layer provides reinforcement to each interconnect.

Hollow-cavity flip-chip package with reinforced interconnects and process for making the same

Embodiments of the present disclosure are directed towards apparatuses, systems, and methods for die attach coatings for semiconductor packages. In one embodiment, a die may be coupled with a substrate by a die attach and a coating may be applied to an edge of the die attach.

Apparatuses, systems, and methods for die attach coatings for semiconductor packages

A new and improved vehicle wash apparatus having a rigid arm with opposite ends. One end is journaled about a generally vertically extending pivot to a washer frame which extends over the vehicle being washed. The rigid arm at its distal end is journaled about a horizontally disposed pivot rod connected to a moveable arm extension having a distal end. A rotary brush is journaled at the distal end of the moveable arm extension for rotation about a vertical axis. The moveable arm extension and brush is moveable both inwardly and outwardly of the vehicle wash frame on both sides of the vertical position and being biased inwardly thereof. The rigid arm is biased into a position generally transverse to the movement of the vehicle being washed relative to the arm, whereby the rotating brush is always in contact with the vehicle being washed. The invention also includes an improved vehicle wash apparatus having such a vehicle wash arm and brush whereby both sides and both ends of the vehicle are all washed in one pass through the vehicle wash apparatus.

Vehicle washing machine

A single balanced self-oscillating dual gate FET mixer includes two dual-gate FETs, a dielectric resonator, two transmission lines inductively coupled to the resonator and connected to the second gates of the two dual-gate FETs, an RF input, two RF matching networks connected to the RF input and to the first gates of the two dual-gate FETs, a 180 degree power combiner, and two IF matching networks connected between the drains of the two dual-gate FETs and to the power combiner. The output of the power combiner is the IF output. The two dual-gate FETs comprise the active device of the oscillator and are used as a nonlinear mixing amplifier. The resonator network provides series feedback with gate 1 of each FET to produce the local oscillator signal and controls the frequency of oscillation. Single balancing of the local oscillator signals injected into gate 1 of each FET is accomplished by mutually coupling the resonator to the two transmission lines, thus providing the required 180 degree phase difference between signals. Finally, the 180 degree power combiner incorporates the phase change necessary for constructive addition of the IF signals originating from each drain port of each FET. With this structure the LO power is removed at the RF input to the mixer owing to the addition of leakage local oscillator signals that are 180 degrees out of phase.

Growing community of inventors

Plano, TX, United States of America

Kevin J Anderson