The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jan. 22, 2015
Applicant:
Triquint Semiconductor, Inc., Hillsboro, OR (US);
Inventors:
Tarak A. Railkar, Plano, TX (US);
Kevin J. Anderson, Plano, TX (US);
Walid Meliane, Frisco, TX (US);
John M. Beall, Richardson, TX (US);
Assignee:
Qorvo US, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 24/83 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/186 (2013.01);
Abstract
Embodiments of the present disclosure are directed towards apparatuses, systems, and methods for die attach coatings for semiconductor packages. In one embodiment, a die may be coupled with a substrate by a die attach and a coating may be applied to an edge of the die attach.