The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Mar. 26, 2018
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Walid M. Meliane, Frisco, TX (US);

Kevin J. Anderson, Plano, TX (US);

Tarak A. Railkar, Plano, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/10 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/50 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/50 (2013.01); H01L 21/565 (2013.01); H01L 23/04 (2013.01); H01L 23/3142 (2013.01); H01L 23/3675 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16168 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1088 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01);
Abstract

The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, a top electronic component, and an external electronic component. The perimeter wall extends from a periphery of a lower side of the top substrate to a periphery of an upper side of the bottom substrate to form a cavity. The bottom electronic component is mounted on the upper side of the bottom substrate and exposed to the cavity. The top electronic component is mounted on the lower side of the top substrate and exposed to the cavity. And the external electronic component is mounted on an upper side of the top substrate, which is opposite the lower side of the top substrate and not exposed to the cavity.


Find Patent Forward Citations

Loading…