The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Oct. 15, 2018
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Mark C. Woods, Richardson, TX (US);

Kelly M. Lear, Longwood, FL (US);

Deepukumar M. Nair, Lake Mary, FL (US);

Tarak A. Railkar, Plano, TX (US);

Bradford Nelson, Redwood City, CA (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); H01L 23/13 (2006.01); H01L 35/08 (2006.01); H01L 35/32 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 35/08 (2013.01); H01L 35/32 (2013.01);
Abstract

The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.


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