The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Aug. 24, 2017
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Tarak A. Railkar, Plano, TX (US);

Ian Y. Yee, Austin, TX (US);

Jeffrey D. Galipeau, Apopka, FL (US);

Jason Wu, Windermere, FL (US);

Rodolfo E. Chang, Longwood, FL (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/50 (2006.01); H01L 21/44 (2006.01); H05K 1/14 (2006.01); B23K 20/24 (2006.01); H01L 23/495 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); B81B 7/00 (2006.01); H01L 23/482 (2006.01); H01L 23/00 (2006.01); H03H 9/00 (2006.01); H03H 9/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); B81B 7/0061 (2013.01); H01L 21/02186 (2013.01); H01L 21/4853 (2013.01); H01L 21/52 (2013.01); H01L 21/563 (2013.01); H01L 23/482 (2013.01); H01L 23/49506 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01); H01L 24/00 (2013.01); H03H 9/00 (2013.01); H03H 9/08 (2013.01);
Abstract

The present disclosure relates to a high-power acoustic device with improved performance. The disclosed acoustic device includes a substrate, a die-attach material, and an acoustic die. The substrate includes a substrate body and a die pad on a top surface of the substrate body. The die-attach material is a sintered material and applied over the die pad. The acoustic die is coupled to the die pad via the die-attach material. Herein, the acoustic die includes a die body and a metallization structure, which is sandwiched between the die body and the die-attach material.


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