Company Filing History:

10 out of 192

Microelectronics and Computer Technology Corporation

Triquint Semiconductor Corporation

patents

Years Active: 1990-2019

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10367470 - Wafer-level-packaged BAW devices with surface mount connection structures (2019-07-30),

2. 10141245 - High-power acoustic device with improved performance (2018-11-27),

3. 9209380 - Acoustic wave device (2015-12-08),

4. 5211807 - Titanium-tungsten etching solutions (1993-05-18),

5. 5167992 - Selective electroless plating process for metal conductors (1992-12-01),

6. 5137597 - Fabrication of metal pillars in an electronic component using polishing (1992-08-11),

7. 5135636 - Electroplating method (1992-08-04),

8. 5116463 - Detecting completion of electroless via fill (1992-05-26),

9. 5084299 - Method for patterning electroless plated metal on a polymer substrate (1992-01-28),

10. 5078852 - Plating rack (1992-01-07),

11. 5021399 - Spray pyrolysis process for preparing superconductive films (1991-06-04),

12. 4952275 - Copper etching solution and method (1990-08-28),

13. 4920639 - Method of making a multilevel electrical airbridge interconnect (1990-05-01),

Title: Innovations by Ian Y Yee

Introduction

Ian Y Yee is a prominent inventor based in Austin, TX, known for his contributions to the field of acoustic devices. With a total of 13 patents to his name, he has made significant advancements in technology that enhance device performance and efficiency.

Latest Patents

One of his latest patents is for Wafer-level-packaged BAW devices with surface mount connection structures. This innovation relates to a Wafer-Level-Packaged (WLP) Bulk Acoustic Wave (BAW) device that includes a BAW resonator, a WLP enclosure, and a surface mount connection structure. The BAW resonator features a piezoelectric layer with an opening and a bottom electrode lead underneath, allowing for improved functionality. The WLP enclosure is designed to form a cavity, with the piezoelectric layer's opening positioned outside this cavity. The surface mount connection structure enhances the device's connectivity and performance.

Another notable patent is for a high-power acoustic device with improved performance. This device comprises a substrate, a die-attach material, and an acoustic die. The substrate includes a die pad on its top surface, while the die-attach material is a sintered material applied over the die pad. The acoustic die is coupled to the die pad, featuring a die body and a metallization structure that optimizes its performance.

Career Highlights

Ian has worked with several notable companies throughout his career, including Microelectronics and Computer Technology Corporation and Qorvo US, Inc. His experience in these organizations has contributed to his expertise in developing innovative acoustic technologies.

Collaborations

Ian has collaborated with several professionals in his field, including Charles W Lin and James D Wehrly, Jr. These collaborations have further enriched his work and led to advancements in acoustic device technology.

Conclusion

Ian Y Yee's contributions to the field of acoustic devices through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the industry and pave the way for future innovations.

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