The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Oct. 06, 2017
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Matthew L. Wasilik, Plano, TX (US);

Buu Quoc Diep, Murphy, TX (US);

Ian Y. Yee, Austin, TX (US);

Bang Nguyen, Richardson, TX (US);

Ebrahim Andideh, Portland, OR (US);

Robert Kraft, Plano, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/17 (2006.01); H01L 41/29 (2013.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H01L 41/083 (2006.01); H03H 9/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/105 (2013.01); H01L 41/083 (2013.01); H01L 41/29 (2013.01); H03H 9/0014 (2013.01); H03H 9/02015 (2013.01); H03H 9/0514 (2013.01); H03H 9/1014 (2013.01); H03H 9/171 (2013.01); H03H 9/173 (2013.01);
Abstract

The present disclosure relates to a Wafer-Level-Packaged (WLP) Bulk Acoustic Wave (BAW) device that includes a BAW resonator, a WLP enclosure, and a surface mount connection structure. The BAW resonator includes a piezoelectric layer with an opening and a bottom electrode lead underneath the piezoelectric layer, such that a portion of the bottom electrode lead is exposed through the opening of the piezoelectric layer. The WLP enclosure includes a cap and an outer wall that extends from the cap toward the piezoelectric layer to form a cavity. The opening of the piezoelectric layer is outside the cavity. The surface mount connection structure covers a portion of a top surface of the cap and extends continuously over a side portion of the WLP enclosure and to the exposed portion of the bottom electrode lead through the opening of the piezoelectric layer.


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