Buu Quoc Diep

USPTO Granted Patents = 35 (Patent Applications = 5)

CIPO Patents = 3

EPO Patents = 8 (Patent Applications = 9)

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 68(Granted Patents)

Company Filing History:

Texas Instruments Corporation

patents

4. 1 out of 16

Qorvo Biotechnologies, LLC

patents

Years Active: 2008-2025

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35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12388407 - Method for manufacturing acoustic devices with improved performance (2025-08-12),

2. 12031949 - Preventing epoxy bleed-out for biosensor devices (2024-07-09),

3. 11990885 - Method for manufacturing acoustic devices with improved performance (2024-05-21),

4. 10931257 - WLP BAW device with through-WLP vias (2021-02-23),

5. 10659000 - Fluidic sensor device having UV-blocking cover (2020-05-19),

6. 10574210 - BAW devices having top electrode leads with reduced reflectance (2020-02-25),

7. 10367470 - Wafer-level-packaged BAW devices with surface mount connection structures (2019-07-30),

8. 10315918 - Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays (2019-06-11),

9. 10262913 - Wafer level package solder barrier used as vacuum getter (2019-04-16),

10. 9969610 - Wafer level MEMS package including dual seal ring (2018-05-15),

11. 9966320 - Wafer level package solder barrier used as vacuum getter (2018-05-08),

12. 9771258 - Wafer level MEMS package including dual seal ring (2017-09-26),

13. 9708181 - Hermetically sealed package having stress reducing layer (2017-07-18),

14. 9520332 - Wafer level package solder barrier used as vacuum getter (2016-12-13),

15. 9427776 - Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays (2016-08-30),

Title: **Buu Quoc Diep: Innovator in Acoustic Device Technology**

Introduction

Buu Quoc Diep, located in Murphy, TX, is a distinguished inventor with an impressive portfolio of 34 patents. His innovative work primarily focuses on fluidic devices and methods to enhance the performance of acoustic applications.

Latest Patents

Among his latest contributions, Diep has developed a patent aimed at preventing epoxy bleed-out for biosensor devices. This invention outlines a fluidic device featuring a bulk acoustic wave resonator structure, which includes strategically designed surface area regions for functionalization material and a repelling area to safeguard these regions from isolation material bleed-out. Another noteworthy patent addresses a method for manufacturing acoustic devices with improved performance. This method involves a meticulous process of substrate preparation, electrode patterning, and sacrificial layer management to enhance the surface roughness of the bottom electrode, which is critical for optimal piezoelectric layer growth.

Career Highlights

Buu Quoc Diep has held significant roles in renowned companies such as Raytheon Company and Qorvo US, Inc. His background in these leading organizations has solidified his expertise in the field of acoustics and biosensor technology, paving the way for his numerous inventions.

Collaborations

During his career, Diep has had the privilege of collaborating with notable individuals such as Thomas Allan Kocian and Roland W Gooch. These partnerships have enabled him to merge ideas and push the boundaries of innovation in his projects.

Conclusion

Buu Quoc Diep's commitment to advancing technology through his patents exemplifies the spirit of innovation. With a focus on improving device performance and functionality, he continues to contribute significantly to the fields of biosensors and acoustics, making him a key figure in modern technological advancements.

This text is generated by artificial intelligence and may not be accurate.