The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Dec. 17, 2018
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Paul Stokes, Orlando, FL (US);

Fabien Dumont, Longwood, FL (US);

Buu Quoc Diep, Murphy, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H01L 23/31 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H03H 9/105 (2013.01); H01L 23/315 (2013.01); H03H 9/02007 (2013.01); H03H 9/0523 (2013.01); H03H 9/17 (2013.01);
Abstract

The present disclosure relates to a wafer-level packaged (WLP) bulk acoustic wave (BAW) device, which includes a BAW resonator, a WLP enclosure, and an interconnect. The BAW resonator includes a piezoelectric layer with an opening, a bottom electrode lead underneath the opening, and an interface structure extending over the opening and in contact with the bottom electrode lead through the opening. The WLP enclosure includes a cap, an outer wall that extends from the cap toward the piezoelectric layer to form a cavity, and a through-WLP via that extends through the cap and the outer wall and is vertically aligned with the opening of the piezoelectric layer. A portion of the interface structure is exposed to the through-WLP via. The interconnect is formed in the through-WLP via and electrically connected to the interface structure.


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