The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Sep. 20, 2016
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Roland W. Gooch, Dallas, TX (US);

Buu Q. Diep, Murphy, TX (US);

Adam M. Kennedy, Santa Barbara, CA (US);

Stephen H. Black, Tennessee Ridge, TN (US);

Thomas A. Kocian, Dallas, TX (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); B81B 7/00 (2006.01); H01L 23/26 (2006.01); H01L 27/146 (2006.01); B81C 1/00 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); B81B 7/0038 (2013.01); B81C 1/00269 (2013.01); H01L 21/52 (2013.01); H01L 21/76841 (2013.01); H01L 23/26 (2013.01); H01L 23/49866 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); B81B 2201/0207 (2013.01); B81C 2203/035 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.


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