Stephen H Black

This inventor holds 32 USPTO granted patents and 4 published patent applications, plus 6 CIPO patents and 12 EPO patents, primarily in Wafer Level Packaging. Top assignees: Raytheon Company, Indigo Systems Corporation, Ratheon Company. Active years: 2000-2019.

USPTO Granted Patents = 32 (Patent Applications = 4)

% Patents Active = 100.0

CIPO Patents = 6

EPO Patents = 12 (Patent Applications = 18)

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 119(Granted Patents)

Location History:

Buelton, CA (US) (2013 - 2015)
Goleta, CA (US) (2014 - 2015)
Buellton, CA (US) (2000 - 2017)
Tennesse Ridge, TN (US) (2018)
Tennessee Ridge, TN (US) (2016 - 2019)

Company Filing History:

Indigo Systems Corporation

4. 1 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 2000-2019

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Areas of Expertise:

Wafer Level Packaging

Infrared Focal Plane Arrays

Stress Relief Methods

Optical Systems

Integrated Lenslets

Getter Structures

Multichip Packaging

Electro-Optical Sensors

Thermal Imaging Systems

Solder Barriers

Bondline Spacers

Incident Radiation Detectors

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10315918 - Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays (2019-06-11),

2. 10262913 - Wafer level package solder barrier used as vacuum getter (2019-04-16),

3. 9966320 - Wafer level package solder barrier used as vacuum getter (2018-05-08),

4. 9865519 - Use of an external getter to reduce package pressure (2018-01-09),

5. 9708181 - Hermetically sealed package having stress reducing layer (2017-07-18),

6. 9570321 - Use of an external getter to reduce package pressure (2017-02-14),

7. 9520332 - Wafer level package solder barrier used as vacuum getter (2016-12-13),

8. 9427776 - Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays (2016-08-30),

9. 9407820 - Method and apparatus for inhibiting diversion of devices using an embedded accelerometer (2016-08-02),

10. 9334154 - Hermetically sealed package having stress reducing layer (2016-05-10),

11. 9277142 - Infrared thermal imaging system and method (2016-03-01),

12. 9227839 - Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling (2016-01-05),

13. 9196556 - Getter structure and method for forming such structure (2015-11-24),

14. 9187312 - Integrated bondline spacers for wafer level packaged circuit devices (2015-11-17),

15. 9174836 - Integrated bondline spacers for wafer level packaged circuit devices (2015-11-03),

Title: The Inventor Stephen H Black: Pioneering Innovations in Buellton

Introduction: Stephen H Black is a distinguished inventor based in Buellton, California. With a passion for creativity and problem-solving, he has made significant contributions to the field of innovation.

Latest Patents: Stephen H Black holds several patents in various industries, including technology, healthcare, and consumer goods. His recent patents showcase his commitment to developing cutting-edge solutions for everyday challenges.

Career Highlights: Throughout his career, Stephen H Black has demonstrated a keen ability to transform ideas into tangible inventions. His innovative spirit and dedication to excellence have earned him recognition as a leading figure in the inventor community.

Collaborations: Stephen H Black has collaborated with numerous companies, research institutions, and fellow inventors to bring his ideas to life. His collaborative approach has led to the successful development and commercialization of groundbreaking products.

Conclusion: In conclusion, Stephen H Black's remarkable journey as an inventor exemplifies the power of creativity and perseverance in driving meaningful innovation. His contributions have not only enriched the field of invention but have also inspired future generations to pursue their inventive dreams.