The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Oct. 20, 2015
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Stephen H. Black, Tennessee Ridge, TN (US);
Adam M. Kennedy, Santa Barbara, CA (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/322 (2006.01); H01L 23/26 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3225 (2013.01); H01L 23/26 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.