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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12327679 B1

PDFFull Text
Date of Patent:
Jun. 10, 2025

Filed:

Aug. 18, 2023

Process for making laminate substrate with sintered components

Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Tarak A. Railkar, Plano, TX (US);

Deepukumar M. Nair, Lake Mary, FL (US);

Jeffrey Dekosky, Land O' Lakes, FL (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:

Withrow & Terranova, P.L.L.C.

Primary Examiner:

Brian K Talbot

Int. Cl.
CPC ...
H01F 41/04 (2006.01); B22F 1/10 (2022.01); B22F 7/04 (2006.01); B32B 18/00 (2006.01); C04B 35/10 (2006.01); C04B 35/468 (2006.01); C04B 35/47 (2006.01); C04B 35/581 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); H10D 1/66 (2025.01); B05D 3/02 (2006.01); B05D 5/12 (2006.01); B05D 7/00 (2006.01); B22F 1/054 (2022.01); H01F 17/00 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); B22F 1/10 (2022.01); B22F 7/04 (2013.01); B32B 18/00 (2013.01); C04B 35/10 (2013.01); C04B 35/468 (2013.01); C04B 35/47 (2013.01); C04B 35/581 (2013.01); C04B 41/5036 (2013.01); C04B 41/87 (2013.01); H10D 1/665 (2025.01); B05D 3/0254 (2013.01); B05D 5/12 (2013.01); B05D 7/54 (2013.01); B22F 1/054 (2022.01); H01F 17/0006 (2013.01); H01G 4/12 (2013.01);
Abstract

The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.

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