Company Filing History:

9 out of 1,641

Hitachi Chemical Company, Ltd.

patents

Hitachi Borden Chemical Products, Inc.

patents

where one patent can have more than one assignee

Years Active: 1982-1996

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14 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 5569321 - Pre-treating solution for electroless plating (1996-10-29),

2. 5270659 - Apparatus for measuring deposition speed of electroless plating (1993-12-14),

3. 5254156 - Aqueous solution for activation accelerating treatment (1993-10-19),

4. 5206052 - Electroless plating process (1993-04-27),

5. 5198273 - Electroless gold plating solution and method for plating gold therewith (1993-03-30),

6. 5076840 - Electroless copper plating solution (1991-12-31),

7. 4986848 - Catalyst for electroless plating (1991-01-22),

8. 4661417 - Composite of metal and resin having electrolytically reduced metal layer (1987-04-28),

9. 4642161 - Method of bonding copper and resin (1987-02-10),

10. 4546168 - Thermosetting resin composition comprising (1) dicyanamide, (2) (1985-10-08),

11. 4526835 - Multi-layer printed circuit board and process for production thereof (1985-07-02),

12. 4482703 - Thermosetting resin composition comprising dicyanamide and polyvalent (1984-11-13),

13. 4400438 - Process for producing fire retardant and heat resistant copper-clad (1983-08-23),

14. 4346206 - Imide prepolymer from reaction of epoxy compound with bis-imide/diamine (1982-08-24),

Title: Innovations by Inventor Takeshi Shimazaki

Introduction

Takeshi Shimazaki is an accomplished inventor based in Hitachi, Japan, recognized for his significant contributions to the field of electroless plating. With a remarkable portfolio of 14 patents, Shimazaki has demonstrated his commitment to innovation and technological advancement.

Latest Patents

Among his latest patents, Shimazaki developed a novel pretreating solution for electroless plating. This solution, which comprises sulfuric acid, a halide, an organic acid, and water as a diluent, functions effectively as an adhesion accelerating agent. Notably, it does so without generating etching corrosion, boasting a long life and providing exceptional adhesiveness of plated copper to both glass cloth and substrate resins.

Additionally, he patented an apparatus for measuring the deposition speed of electroless plating. This innovative measuring apparatus features a sensor with an electrode couple, designed to measure polarization resistance between the paired electrodes. The sensor drive circuit cyclically applies voltage to the electrodes, allowing for the processing circuit to compute the plating deposition speed, which is then displayed for easy interpretation.

Career Highlights

Takeshi Shimazaki has made substantial contributions during his tenure at leading companies such as Hitachi Chemical Company, Ltd. and Hitachi, Ltd. His work at these organizations has played a pivotal role in advancing technologies related to electroless plating and materials science.

Collaborations

Throughout his career, Shimazaki has collaborated with esteemed colleagues, including Motoyo Wajima and Akio Takahashi. These partnerships have enhanced the development and implementation of innovative solutions in their respective fields.

Conclusion

In conclusion, Takeshi Shimazaki stands out as a prominent inventor whose work has greatly influenced the domain of electroless plating. Through his innovative patents and collaborations, he continues to push the boundaries of technology, making significant contributions to the industry. His dedication to excellence and innovation serves as an inspiration to aspiring inventors and professionals in the field.

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