The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1993
Filed:
Sep. 11, 1990
Setsuo Ando, Kawasaki, JP;
Jiro Ushio, Yokohama, JP;
Takashi Inoue, Yokohama, JP;
Hiroaki Okudaira, Yokohama, JP;
Takeshi Shimazaki, Hitachi, JP;
Hitoshi Yokono, Fujisawa, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.