This inventor holds 57 USPTO granted patents, primarily in Multilayer Circuit Boards (CPC class 260 ). Top assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd., Hitachi Construction Machinery Co., Ltd.. Active years: 1976-1996.
Inventors with similar research interests:
Location History:
- Katsuta, JA (1976 - 1978)
- Yokohama, JP (1981 - 1983)
- Katsuta, JP (1978 - 1990)
- Fujisawa, JP (1984 - 1993)
- Ibaraki, JP (1990 - 1993)
- Toride, JP (1988 - 1996)
Company Filing History:
55 out of 42,713Â 
10 out of 1,641Â 
1 out of 1,508Â 
Years Active: 1976-1996
Areas of Expertise:
Title: Hitoshi Yokono: Innovating the Future of Circuit Boards
Introduction:
Meet Hitoshi Yokono, a prolific inventor hailing from Katsuta, Japan. With an impressive portfolio of 57 patents, Yokono has made significant contributions to the field of circuit board technology. His groundbreaking work in developing innovative copper clad laminates and multilayer printed circuit boards has greatly enhanced the performance and reliability of electronic devices. Let's explore his latest patents, career highlights, collaborations, and the lasting impact of his contributions.
Latest Patents:
Yokono's recent patents showcase his ingenuity in designing copper clad laminates and multilayer printed circuit boards with enhanced adhesion and manufacturing processes. One notable patent involves a copper clad laminate featuring a powerful adhesion between the copper foil and insulating layer. By incorporating a metal layer on the bonding side and cross-linking it with the insulating layer through chemical bonds, Yokono eliminates the need for protrusions, roughing treatment, or black treatment. This innovation streamlines production while maintaining excellent adhesion.
In another patent, Yokono presents a method for producing thin film multilayer wiring boards. This technique reduces thermal stresses during the construction process, improving reliability and reducing production steps. The method involves the use of adhesive bonding to attach an insulating film to a substrate. Wiring conductors are then created using electroplating, forming multiple layers to build the final multilayer construction. By optimizing the process, Yokono has paved the way for more efficient and reliable thin film multilayer wiring boards.
Career Highlights:
During his notable career, Yokono has contributed his remarkable expertise to industry-leading companies such as Hitachi Co., Ltd and Hitachi Chemical Company, Ltd. His collaboration with these renowned organizations exhibits his knack for solving complex technological challenges. By focusing on circuit board innovations, Yokono has played a vital role in advancing the semiconductor industry.
Collaborations:
Throughout his journey, Yokono has worked alongside esteemed colleagues who have further enriched his innovative pursuits. Notable collaborators include Tokio Isogai and Fusaji Shoji. Their combined expertise and shared dedication to technological advancements have undoubtedly fueled their successful endeavors.
Conclusion:
Hitoshi Yokono's numerous patents and pioneering contributions to the field of circuit board technology have solidified his position as a respected inventor. His inventive solutions, particularly in developing copper clad laminates and multilayer printed circuit boards, have greatly improved the performance and reliability of electronic devices. As the world continues to demand faster, smaller, and more powerful electronics, the impact of Yokono's work will continue to shape the future of circuit board design and manufacturing.