The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1992
Filed:
Jun. 12, 1990
Norio Saitou, Iruma, JP;
Hideo Todokoro, Tokyo, JP;
Katsuhiro Kuroda, Hachioji, JP;
Satoru Fukuhara, Katsuta, JP;
Genya Matsuoka, Ome, JP;
Hideo Arima, Yokohama, JP;
Hitoshi Yokono, Toride, JP;
Takashi Inoue, Yokohama, JP;
Hidetaka Shigi, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid substrate. The adjustment layer is formed using a direct printing process in accordance with dispersion of the shape of the thick film circuit substrate to absorb the dispersion of the substrate. Further, in order to absorb dispersion of contraction of the thick film substrate due to sintering, a position of a mark provided on the substrate is detected by an electron beam and thereafter a connection pattern is formed to be connected to a regular pattern.