The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1995
Filed:
Mar. 04, 1992
Hitoshi Yokono, Toride, JP;
Hideo Arima, Yokohama, JP;
Takashi Inoue, Yokohama, JP;
Naoya Kitamura, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A thin film multilayer wiring board-producing method of the present invention is intended to decrease thermal stresses developing during the formation of the multilayer construction, and also to greatly reduce the number of the steps of the process, as compared with a conventional method. A film material can be used as an insulating film of the multilayer wiring board, and is adhesively bonded to a predetermined portion. Wiring conductors are formed by electroplating. The wiring layers are repeated laminated to form the multilayer construction. A metallic film serving as an electrode is formed on one of upper and lower surfaces of a substrate, the metallic film being removed after a multilayer wiring is formed. A soluble insulating film is formed on a metallic undercoat film on the substrate, and grooves are formed in the soluble insulating film, and wiring conductors are formed in the grooves, using either electroplating or both electroplating and electroless plating. Thereafter, the soluble insulating film and the metallic undercoat film are removed. Subsequently, an insoluble insulating film is formed at those locations from which the soluble insulating film and the metallic undercoat have been removed.