The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 1993
Filed:
Mar. 25, 1991
Applicant:
Inventors:
Haruhiko Matsuyama, Hiratsuka, JP;
Mitsuo Yoshimoto, Yokohama, JP;
Jun Tanaka, Yokohama, JP;
Fusaji Shoji, Yokohama, JP;
Hitoshi Yokono, Toride, JP;
Takashi Inoue, Yokohama, JP;
Tetsuya Yamazaki, Yokohama, JP;
Minoru Tanaka, Yokohama, JP;
Hidetaka Shigi, Hadano, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C / ; H01L / ;
U.S. Cl.
CPC ...
174253 ; 257700 ; 257724 ; 257759 ;
Abstract
A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.