IDiyas

For the Inventor, By the Inventor

Hiratsuka, Japan

Haruhiko Matsuyama

USPTO Granted Patents = 17

Average Co-Inventor Count = 5.5

ph-index = 8

Forward Citations = 245(Granted Patents)


Company Filing History:

goldMedal17 out of 42,485 
 
Hitachi, Ltd.
 patents
silverMedal2 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1984-2000

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17 patents (USPTO):Explore Patents
1. 6132852 - Multilayer wiring substrate and method for production thereof (2000-10-17),
2. 6124553 - Multilayer wiring board having vent holes and method of making (2000-09-26),
3. 5970310 - Method for manufacturing multilayer wiring board and wiring pattern (1999-10-19),
4. 5958600 - Circuit board and method of manufacturing the same (1999-09-28),
5. 5868949 - Metalization structure and manufacturing method thereof (1999-02-09),
6. 5851681 - Wiring structure with metal wiring layers and polyimide layers, and (1998-12-22),
7. 5753372 - Wiring structures and method of manufacturing the same (1998-05-19),
8. 5388328 - Process for fabricating an interconnected multilayer board (1995-02-14),
9. 5300735 - Interconnected multilayer boards and fabrication processes thereof (1994-04-05),
10. 5280102 - Heat-resistant bonding materials (1994-01-18),
11. 5208656 - Multilayer wiring substrate and production thereof (1993-05-04),
12. 4824731 - Thin film magnetic head (1989-04-25),
13. 4772505 - Magnetic bubble memory element (1988-09-20),
14. 4748228 - Process for producing organic silicon-terminated polyimide precursor and (1988-05-31),
15. 4686147 - Magnetic head and method of producing the same (1987-08-11),

Title: Haruhiko Matsuyama: Innovator in Multilayer Wiring Substrates

Introduction:

Haruhiko Matsuyama, a prolific inventor hailing from Hiratsuka, Japan, has made significant contributions to the field of multilayer wiring substrates. With a total of 17 patents to his name, Matsuyama's innovative work has revolutionized the production and functionality of wiring systems in various electronic devices.

Latest Patents:

1. Multilayer wiring substrate and method for production thereof: Matsuyama's patented multilayer wiring substrate utilizes a unique resin composition to ensure no void formation during lamination. This substrate boasts excellent adhesive properties at various interfaces, heat stability, and reliability, making it suitable for a wide range of applications in electronics.

2. Multilayer wiring board having vent holes and method of making: Matsuyama's second recent patent focuses on preventing fixing failures caused by organic residue in multilayer wiring systems. The inclusion of vent holes and shield structures in the wiring board design not only enhances performance but also simplifies the manufacturing process.

Career Highlights:

Haruhiko Matsuyama has a rich professional background, having worked at esteemed companies such as Hitachi Co., Ltd and Hitachi Chemical Company, Ltd. His expertise and dedication to innovation have played a pivotal role in advancing wiring technology within these organizations.

Collaborations:

Throughout his career, Matsuyama has collaborated with industry experts like Fusaji Shoji and Fumio Kataoka. Together, they have collectively pushed the boundaries of multilayer wiring substrates, paving the way for enhanced electronic devices and systems.

Conclusion:

In conclusion, Haruhiko Matsuyama stands out as a visionary inventor in the realm of multilayer wiring substrates. His patented technologies have not only improved the performance and reliability of electronic devices but have also inspired future innovations in the field. Matsuyama's contributions continue to shape the landscape of modern technology, solidifying his legacy as a true pioneer in the industry.

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