The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 1998
Filed:
Jul. 10, 1995
Hideo Sotokawa, Yokohama, JP;
Miharu Otani, Atsugi, JP;
Fumio Kataoka, Yokohama, JP;
Fusaji Shoji, Yokohama, JP;
Haruhiko Matsuyama, Hiratsuka, JP;
Eiji Matsuzaki, Yokohama, JP;
Shogi Ikeda, Chousei-gun, JP;
Hidetaka Shigi, Ashigarashimo-gun, JP;
Tetsuya Yamazaki, Yokohama, JP;
Naoki Matsushima, Yokohama, JP;
Shirou Akamatsu, Kodaira, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).