The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1999
Filed:
Nov. 14, 1995
Hideo Sotokawa, Yokohama, JP;
Masashi Nishiki, Fujisawa, JP;
Eiji Matsuzaki, Yokohama, JP;
Hidetaka Shigi, Hakone-machi, JP;
Toshio Terouchi, Hadano, JP;
Mamoru Ogihara, Yamakitamachi kishi, JP;
Haruhiko Matsuyama, Hiratsuka, JP;
Minoru Tanaka, Kanagawa-ken, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.