The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Mar. 12, 1999
Masahiro Suzuki, Iwaki, JP;
Akio Takahashi, Hitachiota, JP;
Minoru Tanaka, Yokohama, JP;
Haruhiko Matsuyama, Hiratsuka, JP;
Haruo Akahoshi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.