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For the Inventor, By the Inventor

Hitachi, Japan

Haruo Akahoshi

This inventor holds 70 USPTO granted patents and 7 published patent applications and 3 EPO patents, primarily in Semiconductor Technology (CPC class H01L). Top assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd., Hitachi Displays, Ltd.. Active years: 1986-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haruo Akahoshi. Retrieved from https://idiyas.com/inventor/haruo-akahoshi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 70 

% Patents Active = 54.3

 

Average Co-Inventor Count = 5.0

ph-index = 17

Forward Citations = 1,047(Granted Patents)

Forward Citations (Not Self Cited) = 1,033(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hitachi, JP (1986 - 2016)
  • Tokyo, JP (2017)

Company Filing History:

goldMedal52 out of 42,743 
 
Hitachi, Ltd.
 patents
silverMedal6 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
bronzeMedal3 out of 1,207 
 
Hitachi Displays, Ltd.
 patents
4. 3 out of 3,781 
 
Renesas Technology Corp.
 patents
5. 2 out of 498 
 
Hitachi Industrial Equipment Systems Co., Ltd.
 patents
6. 2 out of 78 
 
Hitachi Via Mechanics Ltd.
 patents
7. 2 out of 7,659 
 
Renesas Electronics Corporation
 patents
8. 1 out of 836 
 
Hitachi Cable, Inc.
 patents
9. 1 out of 2,874 
 
Hitachi-High-Technologies Corporation
 patents
where one patent can have more than one assignee

Years Active: 1986-2017

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Areas of Expertise:
Semiconductor Device
Electrochemical Measurement
Multilayer Circuit Board
Printed Wiring Board
Electroless Copper Plating
Power Module
Lighting Apparatus
Catalyst Material
Magnetic Recording Medium
Fine Pattern Mold
High Dielectric Constant
70 patents (USPTO):Explore Patents
1. 9789568 - Solder, aluminum wire body and motor using the same (2017-10-17),
2. 9362184 - Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus (2016-06-07),
3. 9234861 - Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing same (2016-01-12),
4. 9136244 - Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film (2015-09-15),
5. 9076780 - Power module and lead frame for power module (2015-07-07),
6. 8995046 - Suspended particle device, light control device using the same, and driving method (2015-03-31),
7. 8946895 - Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus (2015-02-03),
8. 8741380 - Fine metal structure, process for producing the same, fine metal mold and device (2014-06-03),
9. 8479970 - High corrosion resistant equipment for a plant (2013-07-09),
10. 8387255 - Fine pattern mold (2013-03-05),
11. 8366903 - Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method (2013-02-05),
12. 8318332 - Magnetic recording medium, method for fabricating the same, and magnetic storage device (2012-11-27),
13. 8097545 - Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition (2012-01-17),
14. 8083515 - Fine pattern mold (2011-12-27),
15. 8022431 - Illuminating apparatus, method for fabricating the using the same and display apparatus using the same (2011-09-20),

Title: The Innovative Work of Haruo Akahoshi in the Field of Semiconductor Devices

Introduction:

Haruo Akahoshi, a prolific inventor based in Hitachi, Japan, has made significant contributions to the field of semiconductor devices through his inventive patented technologies. With an impressive portfolio of 70 patents, his work has helped shape the advancements in the industry.

Latest Patents:

One of Haruo Akahoshi's latest patents is for a groundbreaking technology involving the soldering of an aluminum wire body and motor. This innovation utilizes a unique solder composition containing oxide glass with vanadium and conducting particles, resulting in enhanced performance and durability. Additionally, he has patented a semiconductor device with Cu wiring that reduces surface voids significantly, revolutionizing the manufacturing and inspecting processes in the semiconductor industry.

Career Highlights:

Having worked with renowned companies such as Hitachi, Ltd. and Hitachi Chemical Company, Ltd., Haruo Akahoshi has garnered extensive experience and expertise in the field. His relentless pursuit of innovation and dedication to pushing technological boundaries have earned him a reputation as a visionary inventor in the semiconductor domain.

Collaborations:

Throughout his illustrious career, Haruo Akahoshi has had the privilege of collaborating with industry experts such as Takeyuki Itabashi and Akio Takahashi. These collaborations have been instrumental in driving innovation, fostering creativity, and bringing revolutionary ideas to life in the semiconductor sector.

Conclusion:

In conclusion, Haruo Akahoshi's remarkable contributions to the semiconductor industry through his patented inventions have solidified his position as a trailblazing inventor. His cutting-edge technologies and collaborative spirit continue to inspire advancements in semiconductor devices, shaping the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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