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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9076780 B1

PDFFull Text
Date of Patent:
Jul. 07, 2015

Filed:

Dec. 13, 2011

Power module and lead frame for power module

Applicants:

Yoshinori Negishi, Hitachi, JP;

Hiroshi Nakano, Naka-gun, JP;

Eiichi Ide, Hitachi, JP;

Haruo Akahoshi, Hitachi, JP;

Motoko Harada, Hitachi, JP;

Toshiaki Ishii, Hitachi, JP;

Inventors:

Yoshinori Negishi, Hitachi, JP;

Hiroshi Nakano, Naka-gun, JP;

Eiichi Ide, Hitachi, JP;

Haruo Akahoshi, Hitachi, JP;

Motoko Harada, Hitachi, JP;

Toshiaki Ishii, Hitachi, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Fei Fei Yeung Lopez

Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 24/26 (2013.01); H01L 24/27 (2013.01); H01L 24/28 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 21/4803 (2013.01); H01L 21/4807 (2013.01); H01L 21/481 (2013.01); H01L 21/4871 (2013.01); H01L 21/4878 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 23/49582 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1305 (2013.01);
Abstract

The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.

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