Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Renesas Technology Corp.

Hitachi Displays, Ltd.

Renesas Electronics Corporation

Hitachi Industrial Equipment Systems Co., Ltd.

Hitachi Via Mechanics Ltd.

Hitachi-High-Technologies Corporation

Hitachi Cable, Inc.

Haruo Akahoshi

Takeyuki Itabashi

Akio Takahashi

Akira Nagai

Masahiko Ogino

Hiroshi Nakano

Motoyo Wajima

Takumi Ueno

Asao Nishimura

Toshiya Satoh

Shuji Eguchi

Hiroki Kaneko

Hideki Tanaka

Toshiaki Tanaka

Ikuo Hiyama

Yuichi Satsu

Toshiaki Ishii

Ichiro Anjo

Akihiro Miyauchi

Tadashi Fujieda

Takao Miwa

Tokihito Suwa

Tsunenori Yamamoto

Ichiro Anjoh

Akio Mukoh

Naotaka Tanaka

Toshikazu Narahara

Takahiko Kato

Masanori Segawa

Mitsuru Hasegawa

Satoru Amou

Kunio Arai

Katsumi Kondo

Masaya Adachi

Hiroshi Yamazaki

Takashi Naito

Hiroshi Shimizu

Noriyuki Sakuma

Shinya Imano

Taku Sakazume

Yoshio Homma

Nobuyuki Hayashi

Takuya Aoyagi

Akitoyo Konno

Fumiyuki Kobayashi

Eiichi Ide

Yoshitaka Kojima

Mineo Kawamoto

Kanji Murakami

Hiroshi Yoshida

Toshiaki Ishimaru

Naoki Nishimura

Toyofusa Yoshimura

Tadashi Iida

Toshio Haba

Eiji Takai

Yoshinori Ueda

Masashi Miyazaki

Kiyonori Kogawa

Katsumi Mabuchi

Hitoshi Suzuki

Masahiro Suzuki

Kenya Ohashi

Hiroshi Kanemoto

Masatoshi Sugimasa

Ritsuji Toba

Toshiro Saito

Junichi Katagiri

Yoshihiro Suzuki

Tetsuo Fujiwara

Shinichi Fukada

Koji Suzuki

Shin Nishimura

Motomune Kodama

Yuichi Sawai

Kinya Kobayashi

Kenta Imai

Takeshi Nojiri

Hideaki Katayama

Ryuji Watanabe

Shigeo Amagi

Shigehisa Motowaki

Haruhiko Matsuyama

Masanori Miyagi

Juichi Arai

Shinji Tsuchikawa

Tsutomu Imai

Takeshi Shimazaki

Norihisa Iwasaki

Takao Iwayanagi

Shiro Kobayashi

Seunghwan Park

Osamu Miura

Hideyuki Arikawa

Haruo Suzuki

Akinori Hanawa

Akihiro Sano

Tomoe Takamura

Ryo Ishibashi

Yoshihiro Nakamura

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of AgO in terms of oxides and the glass transition point is 180&#xb0; C. or less.

Solder, aluminum wire body and motor using the same

A semiconductor device having Cu wiring including a basic crystal structure which can reduce surface voids, and an inspecting technique for the semiconductor device. In the semiconductor device, surface voids can be reduced down to 1/10 or less of a current practical level by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 27 or less to all crystal grain boundaries of a Cu wiring to 60% or higher. Alternatively, a similar effect of surface void reduction can be obtained by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 3 to all crystal grain boundaries of a Cu wiring to 40% or higher.

Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus

Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing same

Reliability is improved by improving adhesiveness, crack resistance, and moisture resistance of a metal member-resin jointed body by enhancing adhesiveness between the metal member and the resin. A jointed body of a metal member and a resin including: an intermediate layer and a silane coupling agent layer formed on the metal member at an interface between the metal member and the resin, wherein the silane coupling agent layer and the resin are contacted; the intermediate layer is any one of an oxide layer of the metal, a chelating agent layer, a composite layer made of the oxide layer and the chelating agent layer, and a mixed layer made of the oxide and the chelating agent; and the intermediate layer has an electrically non-insulating characteristic, and a method of manufacturing the same.

Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film

The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.

Power module and lead frame for power module

A suspended particle device includes a first substrate; a second substrate; a first electrode that can be controlled for a potential; a second electrode that can be controlled for a potential different from that of the first electrode; an electrified body; and a liquid suspension containing charged light control particles and a dispersion medium, in which the first electrode, the second electrode and the electrified body are disposed between the first substrate and the second substrate, and the liquid suspension is sealed between the first substrate and the second substrate, and the light control particles are capable of being accumulated to a periphery of the electrified body. Thus, it is possible to ensure uniformity of transmission light as well as to hold a light transmittance state in a state where the power supply is stopped.

Suspended particle device, light control device using the same, and driving method

A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

Fine metal structure, process for producing the same, fine metal mold and device

Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate and a support portion which are made of a high corrosion resistance material and a structural material portion made of a steel material or the like. The lining plate and the support portion include a joining portion to which friction stirring is applied. The support portion is assembled into or fastened to the structural material portion by means of the geometrical structure with a gap interposed between the support portion and the structural material portion. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.

High corrosion resistant equipment for a plant

The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

Fine pattern mold

In a method of manufacturing a printed wiring board, a via reaches from a surface copper layer to an inner-layer copper layer of a multilayer board, and copper layers and insulating layers are alternately layered. The wiring board is machined by a laser, and a process of machining the via includes forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board. The laser is irradiated, and an electrolytic etching and removal of the laser absorbing layer is carried out in this order.

Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method

A discrete track medium and a patterned medium that are excellent in both magnetic recording properties and corrosion resistance are realized. The medium has a magnetic recording layer, which includes a magnetic region formed in a projection portion of a projection/recess pattern over a substrate and a filler region embedded in a recess portion of the projection/recess pattern, and an organic compound, which exhibits corrosion inhibition action for cobalt or cobalt alloys, between the magnetic region and the filler region.

Magnetic recording medium, method for fabricating the same, and magnetic storage device

It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80&#xb0; C. to 140&#xb0; C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170&#xb0; C. to 230&#xb0; C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition

The fine pattern mold comprises: that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

An illuminating apparatus has a reduced number of mounting spots by soldering or the like to permit an increased yield rate and a reduced cost. The illuminating apparatus has light emitting diodes, lead frames, and a transparent sealer. N light emitting diodes, N sets of lead frames mounted with the N light emitting diodes, and one set or more of lead frames each not mounted with a light emitting diode are sealed by the transparent sealer for integration into a modular illuminating apparatus. Also provided are a method for fabricating the illuminating apparatus, and a display apparatus using the illuminating apparatus.

Illuminating apparatus, method for fabricating the using the same and display apparatus using the same

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Hitachi, Japan

Haruo Akahoshi