For the Inventor, By the Inventor

Enter assignee name

Kanagawa, Japan

Hitachi Via Mechanics Ltd.

USPTO Granted Patents = 78

EPO Patents = 1

Trademarks = 1

Forward Citations = 475

Loading Chart...

Loading Chart...

103 inventors (with patents filed for the assignee):

Todd E Lizotte (18 out of 27 patents)

Kunio Arai (13 out of 27 patents)

Katsuhiro Nagasawa (10 out of 10 patents)

4. Yasushi Ito (10 out of 11 patents)

5. Souichi Toyama (7 out of 11 patents)

6. Yaichi Okubo (7 out of 8 patents)

7. Orest Ohar (6 out of 12 patents)

8. Yoshitatsu Naito (4 out of 5 patents)

9. Hiroyuki Sugawara (4 out of 4 patents)

10. Yoshitada Oshida (4 out of 4 patents)

11. Hiroshi Aoyama (4 out of 11 patents)

12. Nobuhiko Suzuki (4 out of 4 patents)

13. Haruaki Otsuki (4 out of 4 patents)

14. Atsushi Sakamoto (4 out of 4 patents)

15. Hiromu Hirai (3 out of 5 patents)

Core Competencies:

Printed Circuit Board

Laser Machining

Fiber Laser

Microvias

Exposure Apparatus

Drilling Method

Servo Control System

Optical Imaging

Beam Drift Compensation

Multi-Layer Circuit Board

Electrolytic Etching

Machining Apparatus

78 patents: Sort by Forward Citations

1. 8366903 - Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method (2013-02-05),

2. 8356961 - Machining apparatus and machining method (2013-01-22),

3. 8319147 - Laser machining method and laser machining apparatus (2012-11-27),

4. 8314825 - Laser direct imaging apparatus and imaging method (2012-11-20),

5. 8278594 - Method and apparatus for perforating printed circuit board (2012-10-02),

6. 8175402 - Drawing apparatus (2012-05-08),

7. 8151455 - Printed circuit board and method of manufacturing the same (2012-04-10),

8. 8121155 - Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming or milling applications (2012-02-21),

9. 8089614 - Device for changing pitch between light beam axes, and substrate exposure apparatus (2012-01-03),

10. 8075788 - Fabrication method of printed circuit board and printed circuit board machining apparatus (2011-12-13),

11. 7969636 - Laser direct imaging apparatus (2011-06-28),

12. 7959385 - Printed circuit board machining apparatus (2011-06-14),

13. 7952050 - Drilling method and laser machining apparatus (2011-05-31),

14. 7933675 - Machining apparatus for drilling printed circuit board (2011-04-26),

15. 7929127 - Laser energy measuring unit and laser machining apparatus (2011-04-19),

Hitachi Via Mechanics Ltd. is a subsidiary of Hitachi Ltd. that specializes in the development and manufacturing of high-performance industrial machinery components. With expertise in precision positioning systems, motion control solutions, and advanced automation technologies, the company serves customers in various industries such as semiconductor manufacturing, automotive, and aerospace. As a leading provider of industrial machinery solutions, Hitachi Via Mechanics Ltd. continuously strives for technological innovation and customer satisfaction.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

78 Patents

#39 in Kanagawa

#1,296 in Japan

#9,415 in the World

Kanagawa, Japan

Hitachi Via Mechanics Ltd.

Forward Citations = 475

103 inventors:

Todd E Lizotte (18 out of 27 patents)

Kunio Arai (13 out of 27 patents)

Katsuhiro Nagasawa (10 out of 10 patents)

4. Yasushi Ito (10 out of 11 patents)

5. Souichi Toyama (7 out of 11 patents)

Please report any incorrect information to support@idiyas.com

Loading…