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Kanagawa, Japan

Hitachi Via Mechanics Ltd.

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USPTO Granted Patents = 78

% Expired Patents = 57.7

EPO Patents = 1

Forward Citations = 484

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103 inventors (with patents filed for the assignee):

Todd E Lizotte (18 out of 27 patents)

Kunio Arai (13 out of 27 patents)

Katsuhiro Nagasawa (10 out of 10 patents)

4. Yasushi Ito (10 out of 11 patents)

5. Souichi Toyama (7 out of 11 patents)

6. Yaichi Okubo (7 out of 8 patents)

7. Orest Ohar (6 out of 12 patents)

8. Yoshitatsu Naito (4 out of 5 patents)

9. Hiroyuki Sugawara (4 out of 4 patents)

10. Yoshitada Oshida (4 out of 4 patents)

11. Hiroshi Aoyama (4 out of 11 patents)

12. Nobuhiko Suzuki (4 out of 4 patents)

13. Haruaki Otsuki (4 out of 4 patents)

14. Atsushi Sakamoto (4 out of 4 patents)

15. Hiromu Hirai (3 out of 5 patents)

Core Competencies:

Laser Machining

Printed Circuit Board

Microvia Production

Drilling Method

Exposure Apparatus

Beam Shaping

Optical Scanner

Manufacturing Method

Fiber Laser

Inspection Method

Machining Apparatus

Servo Control

78 patents: Sort by Forward Citations

1. 8366903 - Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method (2013-02-05),

2. 8356961 - Machining apparatus and machining method (2013-01-22),

3. 8319147 - Laser machining method and laser machining apparatus (2012-11-27),

4. 8314825 - Laser direct imaging apparatus and imaging method (2012-11-20),

5. 8278594 - Method and apparatus for perforating printed circuit board (2012-10-02),

6. 8175402 - Drawing apparatus (2012-05-08),

7. 8151455 - Printed circuit board and method of manufacturing the same (2012-04-10),

8. 8121155 - Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming or milling applications (2012-02-21),

9. 8089614 - Device for changing pitch between light beam axes, and substrate exposure apparatus (2012-01-03),

10. 8075788 - Fabrication method of printed circuit board and printed circuit board machining apparatus (2011-12-13),

11. 7969636 - Laser direct imaging apparatus (2011-06-28),

12. 7959385 - Printed circuit board machining apparatus (2011-06-14),

13. 7952050 - Drilling method and laser machining apparatus (2011-05-31),

14. 7933675 - Machining apparatus for drilling printed circuit board (2011-04-26),

15. 7929127 - Laser energy measuring unit and laser machining apparatus (2011-04-19),

Company Overview

Hitachi Via Mechanics Ltd., based in Kanagawa, Japan, specializes in advanced laser machining technology, focusing on the production of printed circuit boards and microvias. The company is recognized for its innovative approaches in drilling methods and exposure apparatus, enhancing manufacturing processes in electronics. With expertise in beam shaping and optical scanning, Hitachi Via Mechanics plays a pivotal role in the precision engineering sector, contributing to the development of cutting-edge solutions for various industrial applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

78 Patents

#45 in Kanagawa

#1,326 in Japan

#9,691 in the World

Kanagawa, Japan

Hitachi Via Mechanics Ltd.

Forward Citations = 484

103 inventors:

Todd E Lizotte (18 out of 27 patents)

Kunio Arai (13 out of 27 patents)

Katsuhiro Nagasawa (10 out of 10 patents)

4. Yasushi Ito (10 out of 11 patents)

5. Souichi Toyama (7 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hitachi Via Mechanics Ltd.. Retrieved from https://idiyas.com/company/hitachi-via-mechanics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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