The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Mar. 03, 2009
Kunio Arai, Ebina, JP;
Hiroyuki Sugawara, Hitachinaka, JP;
Hiroaki Ashizawa, Ebina, JP;
Hiromi Nishiyawa, Ebina, JP;
Kunio Arai, Ebina, JP;
Hiroyuki Sugawara, Hitachinaka, JP;
Hiroaki Ashizawa, Ebina, JP;
Hiromi Nishiyawa, Ebina, JP;
Hitachi Via Mechanics, Ltd., Ebina-shi, JP;
Abstract
A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layeris irradiated with a pulsed laser beamwhose energy density is set at a value high enough to process the conductor layerwhile emissionfrom a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layeris obtained. An insulating layeris irradiated with a pulsed laser beamwhose energy density is set at a value high enough to process the insulating layerbut low enough not to process a conductor layer+1 under the insulating layer. Thus, the number of pulses of irradiation required for processing a window in the insulating layeris obtained. The conductor layeris irradiated with the laser beamthe obtained number of pulses of irradiation, and the insulating layeris irradiated with the laser beamthe obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.