Atsugi, Japan

Kunio Arai


Average Co-Inventor Count = 2.3

ph-index = 13

Forward Citations = 378(Granted Patents)


Location History:

  • Atsugi, JP (1989 - 2003)
  • Ebina, JP (2003 - 2013)

Company Filing History:


Years Active: 1989-2013

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27 patents (USPTO):

Title: **Kunio Arai: Innovator in Printed Wiring Board Technology**

Introduction

Kunio Arai, an accomplished inventor based in Atsugi, Japan, has made significant contributions to the field of printed wiring board manufacturing. With a remarkable portfolio of 27 patents, Arai has developed innovative methods and solutions that enhance the efficiency and quality of circuit board production.

Latest Patents

Among Arai's latest patents is a comprehensive **method for manufacturing printed wiring boards**. This method meticulously details the process in which a via extends from a surface copper layer to an inner-layer copper layer within a multilayer board. Arai’s approach involves the alternating layering of copper and insulating layers, followed by precise laser machining. Additionally, he has developed an **electrolytic etching solution** that plays a critical role in the production process, where the laser machining includes the formation of a laser absorbing layer on the copper surface of the multilayer board.

Another notable patent is his **laser machining method and apparatus**, which significantly enhance the machining accuracy and quality without compromising efficiency. This innovative process utilizes split beams from a pulsed laser to improve the machining quality of circular holes by synchronizing the circling directions and angular velocities of the beams. A beam splitter and acousto-optic modulators facilitate the precise delivery of these split beams, making Arai’s technologies stand out in the industry.

Career Highlights

Kunio Arai's illustrious career includes tenures at well-known corporations such as Hitachi Seiko and Hitachi Via Mechanics. During his time with these companies, he honed his skills in laser technology and circuit board manufacturing, leading to numerous patents that have propelled advancements in the electronics sector.

Collaborations

Throughout his career, Arai has collaborated with other skilled professionals such as Yasuhiko Kanaya and Hiroshi Aoyama. These partnerships have fostered a dynamic exchange of ideas, contributing to the development of cutting-edge technologies and improving existing methodologies within their field.

Conclusion

Kunio Arai's contributions to the manufacturing of printed wiring boards are significant and far-reaching. With his 27 patents showcasing innovative methods and solutions, he has established himself as a leading figure in the industry. As technology continues to evolve, Arai's work will undoubtedly play a pivotal role in shaping the future of electronics manufacturing.

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