The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Feb. 23, 1996
Kunio Arai, Atsugi, JP;
Hitachi Seiko Ltd., Ebina, JP;
Abstract
The disclosure relates to spot-facing for exposing an inner-layer conductor embedded in an insulator of a printed circuit board. The spot-facing removes the entire insulator by a mechanical cutter, except a part thereof, to a position just above the inner-layer conductor. The part of the insulator is smaller in thickness than the insulator removed by the mechanical cutter. Then, the remaining part of the insulator is removed by scanning the part with a laser beam to expose the inner-layer conductor. The laser beam is in a slender shape almost perpendicular to the scanning direction of the laser beam and has an almost uniform energy density along the slender shape. Cutter processing is sufficient to be done before the inner-layer conductor, and there is no fear of damaging the inner-layer conductor. Moreover, laser-beam processing is easy to control thermal influence on the portion to be processed of the circuit board, because the energy density of the laser beam is almost uniform. Therefore, the product yield according to the processing is improved.