The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Aug. 23, 2007
Hidenori Tateishi, Ebina, JP;
Masaru Futaana, Ebina, JP;
Yuki Saeki, Ebina, JP;
Yasunobu Ueno, Ebina, JP;
Hidenori Tateishi, Ebina, JP;
Masaru Futaana, Ebina, JP;
Yuki Saeki, Ebina, JP;
Yasunobu Ueno, Ebina, JP;
Hitachi Via Mechanics, Ltd., Ebina-shi, JP;
Abstract
A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 μm high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.