This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Via Mechanics Ltd.. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Masaru Futaana: Innovator in Drilling Methods and Laser Machining
Introduction
Masaru Futaana is a notable inventor based in Ebina, Japan. He has made significant contributions to the field of machining technology, particularly through his innovative drilling methods and laser machining apparatus. His work focuses on improving efficiency and accuracy in machining processes.
Latest Patents
Futaana holds a patent for a drilling method and laser machining apparatus. This invention addresses the challenges of measuring workpiece surface height, especially when dealing with irregularities ranging from 10 to 30 micrometers. The method involves measuring surface heights at predetermined lattice points and calculating the top surface height at desired points on the workpiece. This approach enhances machining efficiency by accurately determining the plate thickness and adjusting for surface irregularities.
Career Highlights
Masaru Futaana is associated with Hitachi Via Mechanics Ltd., where he applies his expertise in machining technology. His innovative solutions have contributed to advancements in the industry, making processes more efficient and reliable.
Collaborations
Futaana has worked alongside talented colleagues, including Hidenori Tateishi and Yuki Saeki. Their collaborative efforts have furthered the development of cutting-edge technologies in machining.
Conclusion
Masaru Futaana's contributions to drilling methods and laser machining have established him as a key figure in the field. His innovative approaches continue to influence the efficiency and accuracy of machining processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
