The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 1994
Filed:
Mar. 28, 1990
Applicant:
Inventors:
Haruhiko Matsuyama, Hiratsuka, JP;
Fusaji Shoji, Yokohama, JP;
Atsushi Honda, Kokubunji, JP;
Teruki Aizawa, Shimodate, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi Chemical Co., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08G / ;
U.S. Cl.
CPC ...
528353 ; 528 26 ; 528 38 ; 528125 ; 528126 ; 528128 ; 528170 ; 528172 ; 528176 ; 528182 ; 528185 ; 528188 ; 528220 ; 528224 ; 528229 ; 528351 ; 4284735 ;
Abstract
Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.
Quick Actions:
Matsuyama, Haruhiko. (1994). Heat-resistant bonding materials (U.S. Patent No. 5280102). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5280102
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile