The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 1993
Filed:
Jun. 04, 1990
Jiro Ushio, Yokohama, JP;
Osamu Miyazawa, Yokosuka, JP;
Akira Tomizawa, Yokohama, JP;
Hitoshi Yokono, Ibaraki, JP;
Naoya Kanda, Yokohama, JP;
Naoko Matsuura, Yokohama, JP;
Setsuo Ando, Kawasaki, JP;
Hiroaki Okudaira, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same. According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths. Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.