Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Hitachi Borden Chemical Products, Inc.

Takeshi Shimazaki

Akio Takahashi

Motoyo Wajima

Hirosada Morishita

Akishi Nakaso

Yutaka Itoh

Kenji Tsukanishi

Shunya Yokozawa

Yutaka Mizuno

Kaoru Oginuma

Takao Takita

Hiroyuki Toyoda

Haruo Akahoshi

Takashi Inoue

Hitoshi Yokono

Toshikazu Narahara

Kanji Murakami

Hiroaki Okudaira

Yoshihiro Suzuki

Ritsuji Toba

Kiyonori Kogawa

Jiro Ushio

Setsuo Ando

Hiroshi Yamamoto

Kazuichi Kuramochi

Takeshi Sakai

Kazuichi Kuramoti

Nobuhiro Satoh

Satoshi Akazawa

A pretreating solution for electroless plating comprising sulfuric acid, a halide, an organic acid and water as a diluent functions as an adhesion accelerating agent without generating etching corrosion, has a long life and provides excellent adhesiveness of plated copper to both glass cloth and substrate resins.

Pre-treating solution for electroless plating

An electroless plating deposition speed measuring apparatus is provided with a sensor having an electrode couple whose pair of electrodes are opposed to each other and a sensor drive circuit that cyclically applies voltage to the electrode couple to measure a polarization resistance between the pair of electrodes of the electrode couple. Measuring data from the sensor drive circuit are supplied to a processing circuit. The processing circuit computes and processes the measuring data to find the plating deposition speed. Data of the plating deposition speed from the processing circuit are supplied to a display circuit to display the data of the plating deposition speed. In a preferred embodiment, each of the pair of electrodes of the electrode couple has a conductor and a non-conductor, wherein the surfaces of the conductors and the non-conductors of the respective electrodes are arranged in facing and opposite relation to each other. Each of the conductors is made of a noble-metal material, such as copper, gold, platinum, palladium or the like, while each of the non-conductors is made of an alkaliproof non-conductive material, such as epoxy resin, epoxy resin of a glass base material, or the like.

Apparatus for measuring deposition speed of electroless plating

An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.

Aqueous solution for activation accelerating treatment

Electroless plating process

The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.

Electroless gold plating solution and method for plating gold therewith

An electroless copper plating solution comprising a cupric salt, a copper complexing agent, a reducing agent, a pH adjustor, L-arginine and at least one of .alpha.,.alpha.'-dipyridyl and a cyano complex compound can give plated films high in ductility and adhesive strength and excellent in mechanical properties.

Electroless copper plating solution

A catalyst for electroless plating comprising a divalent palladium compound, a lower alkylamine, and aminopyridine in the form of aqeuous solution having a pH of 7 to 14 can give uniform deposition and high throwing power of copper on inner walls of through-holes in printing wiring boards without causing a hollowing phenomenon.

Catalyst for electroless plating

A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.

Composite of metal and resin having electrolytically reduced metal layer

A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

Method of bonding copper and resin

A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.

Thermosetting resin composition comprising (1) dicyanamide, (2)

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg.sub.1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and that of Tg.sub.2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, has excellent dimensional stability, heat resistance and through-hole reliability.

Multi-layer printed circuit board and process for production thereof

A thermosetting resin composition comprises (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds. A thermosetting prepolymer can be obtained by subjecting the composition to a preliminary reaction with heating to the B stage and this prepolymer can give a cured product having excellent heat resistance of class C and flexibility. An exemplary composition containing 60 parts by wt. of 4,4'-dicyanomidodiphenylmethane and 40 parts by wt. of N,N'-4,4'-diphenylmethane bismaleimide dissolved in methyl Cellosolve is reacted at 70.degree. to 110.degree. C. for about 40 minutes to obtain a prepolymer soluble in methyl ethyl ketone. This prepolymer when admixed with 2-ethyl-4-methyl-imidazole and after removal of the methyl cellusolve will form an insoluble and infusible cured product upon heating at temperatures on the order of 170.degree. to 200.degree. C. for about 80 minutes. The resin composition when admixed with a solvent, is useful for impregnation and when used as a powder, it is useful as a molding resin.

Thermosetting resin composition comprising dicyanamide and polyvalent

A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.

Process for producing fire retardant and heat resistant copper-clad

A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

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Hitachi, Japan

Takeshi Shimazaki