The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 1991
Filed:
Jan. 04, 1990
Applicant:
Inventors:
Takao Takita, Yuki, JP;
Takeshi Shimazaki, Shimodate, JP;
Satoshi Akazawa, Shimodate, JP;
Kazuichi Kuramoti, Shimodate, JP;
Hiroyuki Toyoda, Tochigi, JP;
Assignees:
Hitachi Chemical Co. Ltd., Tokyo, JP;
Hitachi Borden Chemical Products, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
106-123 ; 106-126 ;
Abstract
An electroless copper plating solution comprising a cupric salt, a copper complexing agent, a reducing agent, a pH adjustor, L-arginine and at least one of .alpha.,.alpha.'-dipyridyl and a cyano complex compound can give plated films high in ductility and adhesive strength and excellent in mechanical properties.