The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 1987
Filed:
Jan. 27, 1986
Applicant:
Inventors:
Haruo Akahoshi, Hitachi, JP;
Kanji Murakami, Mito, JP;
Motoyo Wajima, Hitachi, JP;
Kiyonori Kogawa, Hadano, JP;
Ritsuji Toba, Hadano, JP;
Takeshi Shimazaki, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F / ; B44C / ; B31B / ;
U.S. Cl.
CPC ...
156630 ; 156634 ; 156656 ; 156666 ; 156902 ; 1563077 ; 156314 ; 427 96 ;
Abstract
A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.