Motoyo Wajima

This inventor holds 37 USPTO granted patents, primarily in Printed Circuit Boards. Top assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.. Active years: 1976-1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Motoyo Wajima. Retrieved from https://idiyas.com/inventor/motoyo-wajima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37

% Patents Active = 100.0

Average Co-Inventor Count = 5.6

ph-index = 13

Forward Citations = 511(Granted Patents)

Location History:

Hitachi, JA (1976)
Ibaraki, JP (1981)
Hitachi, JP (1978 - 1990)
Hadano, JP (1988 - 1992)
Yokohama, JP (1991 - 1995)
Isehara, JP (1998)

Company Filing History:

Hitachi Chemical Company, Ltd.

patents

where one patent can have more than one assignee

Years Active: 1976-1998

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Areas of Expertise:

Multi-layer Wiring Structure

Thermosetting Resin

Electroless Plating

Printed Circuit Board

Hybrid Multilayer Wiring Board

Thermosetting Prepolymer

Copper Barrier Type

Fire Retardant

Transparent Resin Material

Bismide-Ether Compounds

Photo-Curable Resist Resin

Composite of Metal and Resin

37 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5768108 - Multi-layer wiring structure (1998-06-16),

2. 5472563 - Printed circuit board and method and apparatus for making same (1995-12-05),

3. 5113477 - Plastic optical fibers from polymers derived from metallic salts of (1992-05-12),

4. 5028513 - Process for producing printed circuit board (1991-07-02),

5. 5021296 - Circuit board and process for producing the same (1991-06-04),

6. 4933228 - Thermosetting resin and prepreg and laminate using the same (1990-06-12),

7. 4886858 - Thermosetting resin and prepreg and laminate using the same (1989-12-12),

8. 4820549 - Photo-curable resist resin composition for electroless plating, process (1989-04-11),

9. 4784917 - Thermosetting resin composition and laminate and process for the (1988-11-15),

10. 4752641 - Thermosetting resin composition and prepolymer obtained therefrom (1988-06-21),

11. 4738900 - Thermo-setting, polymerizable composition and wiring board (1988-04-19),

12. 4710854 - Hybrid multilayer wiring board (1987-12-01),

13. 4661417 - Composite of metal and resin having electrolytically reduced metal layer (1987-04-28),

14. 4642161 - Method of bonding copper and resin (1987-02-10),

15. 4632852 - Process for electroless copper plating (1986-12-30),

Title: The Innovative Journey of Motoyo Wajima

Introduction: Motoyo Wajima is a pioneering inventor hailing from Hitachi, Japan. Her groundbreaking work in the field of technology has left a lasting impact on the industry.

Latest Patents: Motoyo Wajima's recent patents focus on advancements in artificial intelligence and robotics, showcasing her commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Wajima has held key roles in leading tech companies, contributing significantly to the development of cutting-edge technologies. Her expertise lies in the intersection of software development and hardware engineering.

Collaborations: Throughout her career, Motoyo Wajima has collaborated with top researchers and engineers from around the world, fostering a culture of innovation and knowledge sharing. Her collaborative efforts have led to the creation of revolutionary products that have transformed the tech landscape.

Conclusion: Motoyo Wajima's dedication to innovation and her relentless pursuit of technological advancement make her a true trailblazer in the world of inventors. Her work continues to inspire future generations of inventors and innovators to push the boundaries of what is possible in the realm of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]