The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 1988
Filed:
Apr. 22, 1986
Keiko Tawara, Ibaraki, JP;
Akira Nagai, Hitachi, JP;
Akio Takahashi, Hitachiota, JP;
Katuo Sugawara, Hitachi, JP;
Masahiro Ono, Hitachi, JP;
Ritsuro Tada, Mito, JP;
Motoyo Wajima, Hadano, JP;
Toshikazu Narahara, Ibaraki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.