The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 1990
Filed:
Jun. 19, 1989
Applicant:
Inventors:
Junichi Katagiri, Ibaraki, JP;
Akira Nagai, Hitachi, JP;
Keiko Tawara, Hitachi, JP;
Akio Takahashi, Hitachiota, JP;
Motoyo Wajima, Hitachi, JP;
Toshikazu Narahara, Ibaraki, JP;
Ryo Hiraga, Hitachiota, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428245 ; 428413 ; 428418 ; 428457 ; 428462 ; 428901 ; 361397 ; 174256 ;
Abstract
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.