Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Motoyo Wajima

Akio Takahashi

Hirosada Morishita

Kanji Murakami

Mineo Kawamoto

Toshikazu Narahara

Akira Nagai

Haruo Akahoshi

Takeshi Shimazaki

Ritsuro Tada

Yutaka Itoh

Katuo Sugawara

Masahiro Ono

Toyofusa Yoshimura

Kenji Tsukanishi

Shoji Kawakubo

Junichi Katagiri

Kiyonori Kogawa

Shunya Yokozawa

Keiko Tawara

Yoichi Matsuda

Yutaka Mizuno

Shuji Eguchi

Ryo Hiraga

Shigeo Amagi

Hideki Asano

Junji Mukai

Noriaki Taketani

Haruo Suzuki

Yoshihiro Suzuki

Ritsuji Toba

Akio Tadokoro

Youichi Matsuda

Makoto Matsunaga

Yuichi Satsu

Tomiya Abe

Nobuyuki Hayashi

Takao Miwa

Seikichi Tanno

Akira Masaki

Kunio Miyazaki

Masahiro Suzuki

Ryuji Watanabe

Minoru Yamada

Toshiaki Ishimaru

Akio Nishikawa

Tohru Koyama

Toru Koyama

Keiichirou Nakanishi

Yoshiaki Okabe

Hiromu Terao

Osamu Miura

Tetsuo Ishikawa

Atsushi Mori

Tomio Yoshida

Nobuaki Ooki

Masami Kawaguchi

Toshinari Takada

Rituji Toba

Kiyoshi Ozaki

Kyoji Kawakubo

Minoru Kanechiku

Nobuhiro Satoh

Hiroko Ohayashi

Hideo Tsuda

A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

Multi-layer wiring structure

The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

Printed circuit board and method and apparatus for making same

A plastic optical fiber comprising a core and a clad, said core being formed by an amorphous and optically transparent polymer and said clad being formed by a polymer having a refractive index lower than that of the core by at least 0.3%, at least one of the core and the clad being formed by an amorphous and optically transparent polymer containing metal elements and halogen atoms, is low in light loss and excellent in heat resistance.

Plastic optical fibers from polymers derived from metallic salts of

The present invention provide a process for producing printed circuit boards which comprises the steps of

Process for producing printed circuit board

A circuit board, which comprises an insulating substrate, a copper wiring having a coarsely roughened surface provided on the insulating substrate, and a copper oxide-reduced layer provided on the coarsely roughened surface of the copper wiring and formed by reduction of copper oxide and electroless plating, the copper oxide-reduced layer having a finely roughed surface and having a deposited layer of at least one of nickel and cobalt, where the copper oxide-reduced layer having a deposited layer of at least one of nickel and cobalt on the surface is roughened in a range of 0.05 to 5 .mu.m in terms of a maximum vertical distance between the top of convex parts and the bottom of concave parts of the copper oxide-reduced layer per .mu.m of the longitudinal distance of the copper oxide-reduced layer, and at least one of nickel and cobalt is deposited in an amount of 5.times.10.sup.-7 to 1.times.10.sup.-4 g/cm.sup.2 on the copper oxide-reduced layer, has a high adhesiveness to an insulating resin.

Circuit board and process for producing the same

A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

Thermosetting resin and prepreg and laminate using the same

A photo-curable resist resin composition for electroless plating comprising an epoxy resin having a viscosity of at least 150 poises at 25.degree. C., and at least two glycidyl ether groups in one molecule, the glycidyl ether groups being directly bonded to the aromatic ring as Component A, an oxirane ring-containing compound having a boiling point of at least 140.degree. C. and a molecular weight of not more than 500 as Component B, and a photo-sensitive aromatic onium salt as Component C, wherein the Component A is in an amount of 90 to 40 parts by weight per total 100 parts by weight of the Components A and B, and the Component C is in an amount of 0.1 to 5 parts by weight per total 100 parts by weight of the Components A and B, and, if any, other resin components, can produce a resist film capable of withstanding highly alkaline electroless copper plating solution at a high temperature for a long time without any decrease in the physical properties of plating films deposited even by repeated use of the electroless copper plating solution. The resist film prepared from the resist resin composition has distinguished soldering heat resistance, solvent resistance and electrical insulation.

Photo-curable resist resin composition for electroless plating, process

A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

Thermosetting resin composition and laminate and process for the

A thermosetting resin composition comprising (a) a polyfunctional maleimide, (b) at least one member selected from the group consisting of alkenylphenols and alkenylphenol ethers, and (c) an allyl ester of polyvalent carboxylic acid, or cyanuric or isocyanuric acid and a prepolymer obtained by preliminarily heating the thermosetting resin composition can be used as a solventless type varnish for impregnating, e.g. electric windings, or for preparing a prepreg, and can give a cured product with heating at 120.degree.-250.degree. C. having excellent heat resistance of class C (180.degree. C. or higher) and electrical insulating properties.

Thermosetting resin composition and prepolymer obtained therefrom

Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.

Thermo-setting, polymerizable composition and wiring board

A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).

Hybrid multilayer wiring board

A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.

Composite of metal and resin having electrolytically reduced metal layer

A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

Method of bonding copper and resin

In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

Process for electroless copper plating

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Hitachi, Japan

Motoyo Wajima