The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 1988
Filed:
Apr. 23, 1986
Masahiro Ono, Hitachi, JP;
Akio Takahashi, Hitachiota, JP;
Katuo Sugawara, Hitachi, JP;
Ritsuro Tada, Mito, JP;
Akira Nagai, Hitachi, JP;
Motoyo Wajima, Hadano, JP;
Toshikazu Narahara, Ibaraki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.