The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1993
Filed:
Oct. 16, 1991
Hiroyuki Toyoda, Ibaragi, JP;
Takeshi Shimazaki, Ibaragi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Hitachi Borden Chemical Products, Inc., Tokyo, JP;
Abstract
An electroless plating deposition speed measuring apparatus is provided with a sensor having an electrode couple whose pair of electrodes are opposed to each other and a sensor drive circuit that cyclically applies voltage to the electrode couple to measure a polarization resistance between the pair of electrodes of the electrode couple. Measuring data from the sensor drive circuit are supplied to a processing circuit. The processing circuit computes and processes the measuring data to find the plating deposition speed. Data of the plating deposition speed from the processing circuit are supplied to a display circuit to display the data of the plating deposition speed. In a preferred embodiment, each of the pair of electrodes of the electrode couple has a conductor and a non-conductor, wherein the surfaces of the conductors and the non-conductors of the respective electrodes are arranged in facing and opposite relation to each other. Each of the conductors is made of a noble-metal material, such as copper, gold, platinum, palladium or the like, while each of the non-conductors is made of an alkaliproof non-conductive material, such as epoxy resin, epoxy resin of a glass base material, or the like.