The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1982
Filed:
Aug. 11, 1980
Akio Takahashi, Hitachioota, JP;
Yutaka Itoh, Hitachi, JP;
Takeshi Shimazaki, Hitachi, JP;
Motoyo Wajima, Hitachi, JP;
Hirosada Morishita, Hitachi, JP;
Yutaka Mizuno, Shimodate, JP;
Shunya Yokozawa, Oyama, JP;
Kenji Tsukanishi, Shimodate, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.