The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 1985

Filed:

Aug. 09, 1984
Applicant:
Inventors:

Akio Takahashi, Hitachiota, JP;

Takeshi Shimazaki, Hitachi, JP;

Motoyo Wajima, Hitachi, JP;

Hirosada Morishita, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
528107 ; 525502 ; 525504 ; 525529 ; 525533 ; 525534 ; 528117 ; 528119 ; 528163 ; 528164 ; 528170 ; 528321 ; 528322 ;
Abstract

A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.


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