The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 1983
Filed:
Mar. 30, 1981
Akio Takahashi, Hitachiohta, JP;
Yutaka Itoh, Hitachi, JP;
Takeshi Shimazaki, Hitachi, JP;
Motoyo Wajima, Hitachi, JP;
Hirosada Morishita, Hitachi, JP;
Yutaka Mizuno, Shimodate, JP;
Shunya Yokozawa, Oyama, JP;
Kenji Tsukanishi, Shimodate, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.