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For the Inventor, By the Inventor

Obu, Japan

Takeshi Endo

USPTO Granted Patents = 23

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 213(Granted Patents)


Location History:

  • Toyoake, JP (2000 - 2002)
  • Oobu, JP (2010)
  • Obu, JP (2006 - 2012)
  • Toyota, JP (2010 - 2013)
  • Kariya, JP (2018 - 2022)

Company Filing History:

goldMedal23 out of 19,697 
 
Denso Corporation
 patents
silverMedal8 out of 36,499 
 
Toyota Jidosha Kabushiki Kaisha
 patents
bronzeMedal1 out of 104 
 
Mirise Technologies Corporation
 patents
where one patent can have more than one assignee

Years Active: 2000-2025

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23 patents (USPTO):Explore Patents
1. 12255120 - Semiconductor device and method of manufacturing the same (2025-03-18),
2. 11532534 - Semiconductor module (2022-12-20),
3. 11101246 - Semiconductor device having chips attached to support members through silver sintered bodies with particles (2021-08-24),
4. 11050314 - Rotating electric machine (2021-06-29),
5. 10134593 - Semiconductor device and method for manufacturing same (2018-11-20),
6. 8470672 - Method of manufacturing silicon carbide semiconductor device (2013-06-25),
7. 8440524 - Semiconductor device manufacturing method (2013-05-14),
8. 8436365 - SiC semiconductor device having Schottky barrier diode and method for manufacturing the same (2013-05-07),
9. 8324704 - Silicon carbide semiconductor device with Schottky barrier diode and method of manufacturing the same (2012-12-04),
10. 8168485 - Semiconductor device making method (2012-05-01),
11. 8163637 - Forming impurity regions in silicon carbide devices (2012-04-24),
12. 8154074 - Silicon carbide semiconductor device and manufacturing method of the same (2012-04-10),
13. 8133787 - SiC semiconductor device and method for manufacturing the same (2012-03-13),
14. 7993966 - Method for manufacturing silicon carbide semiconductor device having high channel mobility (2011-08-09),
15. 7968892 - Silicon carbide semiconductor device (2011-06-28),

Certainly! Here is the article about inventor Takeshi Endo:

Title: Takeshi Endo: Pioneering Innovations in Technology

Introduction: Takeshi Endo, a trailblazing inventor based in Obu, Japan, has made significant contributions to the world of technology with his passion for innovation and relentless drive to push boundaries.

Latest Patents: Takeshi Endo's latest patents include a Semiconductor Module, incorporating a power element, signal wiring, and a heat sink to cool the power element effectively. Another patent involves a Semiconductor Device with chips attached to support members through silver-sintered bodies with particles, showcasing his expertise in semiconductor technology.

Career Highlights: With a total of 22 patents to his name, Takeshi Endo has established himself as a leading figure in the field of technology. His innovative solutions have paved the way for advancements in semiconductor devices, setting new standards in the industry.

Collaborations: Takeshi Endo has collaborated with industry giants such as Denso Corporation and Toyota Motor Corporation. Working alongside colleagues like Eiichi Okuno and Hirokazu Fujiwara, he has brought cutting-edge technologies to life through effective teamwork and shared expertise.

Conclusion: Takeshi Endo's exemplary work ethic and groundbreaking inventions continue to inspire future generations of inventors and innovators. His unwavering dedication to pushing the boundaries of what is possible sets him apart as a true visionary in the world of technology.

I hope you find this article informative and insightful!

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