Neyagawa, Japan

Takahiro Yonezawa

This inventor holds 20 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 1994-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiro Yonezawa. Retrieved from https://idiyas.com/inventor/takahiro-yonezawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 55.0

Average Co-Inventor Count = 5.3

ph-index = 8

Forward Citations = 222(Granted Patents)


Location History:

  • Osaka-fu, JP (2002)
  • Neyagawa, JP (1994 - 2007)

Company Filing History:


Years Active: 1994-2007

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Areas of Expertise:
Bump Bonding
Electronic Component Mounting
IC Chip Packaging
Semiconductor Element
Bonding Method
Bare Chip Mounting
Film Substrate Treatment
Ultrasonic Wire Bonding
Bonding Apparatus
Suction Hold Method
Bump Levelling
Tape-Shaped Carrier
20 patents (USPTO):Explore Patents

Title: **Takahiro Yonezawa: A Pioneer in Electronic Component Innovations**

Introduction

Takahiro Yonezawa is a distinguished inventor based in Neyagawa, Japan, known for his significant contributions to the field of electronic components. With 20 patents to his name, Yonezawa has developed innovative technologies that enhance the efficiency and reliability of electronic component mounting.

Latest Patents

Among his latest patents are two notable inventions. The first is an **Electronic component mounting apparatus and electronic component mounting method**, which utilizes a load sensor equipped with piezoelectric elements to detect vertical and horizontal loads applied to electronic components. This advancement allows for the detection of loads near the component's mounting position while minimizing the size of the load sensor. Furthermore, it includes a comparison mechanism to detect mounting failures through deviations in horizontal load values within a defined tolerance range.

The second patent, titled **Semiconductor element having protruded bump electrodes**, outlines a method for creating a bump electrode on an integrated circuit (IC) electrode. This process involves a series of well-defined steps that ensure the Au wire remains isolated from surrounding areas, significantly enhancing the precision of electronic component bonding.

Career Highlights

Yonezawa's career has been marked by his role at Matsushita Electric Industrial Co., Ltd., a leading firm in the electronics sector. His expertise in electronic component design and mounting has positioned him as a key contributor to the company's innovative initiatives. Yonezawa's commitment to enhancing the operational efficiency of electronic devices is evident in each of his patents.

Collaborations

Throughout his career, Yonezawa has collaborated with notable colleagues, including Makoto Imanishi and Kazushi Higashi. Their combined expertise has propelled innovative projects within their organization, leading to significant advancements in electronic components.

Conclusion

Takahiro Yonezawa's inventive spirit and passion for innovation have made him a prominent figure in the electronics industry. His patents not only showcase his technical prowess but also contribute to the ongoing evolution of electronic components. As the industry continues to grow and evolve, Yonezawa's work will undoubtedly leave a lasting impact.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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