The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2000
Filed:
Jul. 21, 1998
Takahiro Yonezawa, Neyagawa, JP;
Osamu Nakao, Osaka, JP;
Shinji Kanayama, Kajiwara, JP;
Akihiro Yamamoto, Kobe, JP;
Makoto Imanishi, Neyagawa, JP;
Koichi Yoshida, Higashi-Osaka, JP;
Abstract
The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).